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Edison Module Hg 331189 002

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    Intel® Edison Module Hardware Guide September 2014 Revision 002 Document Number: 331189-002    Notice:  This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Intel software products are copyrighted by and shall remain the property of Intel Corporation. Use, duplication, or disclosure is subject to restrictions stated in Intel’s Software License Agreement, or in the case of software delivered to the government, in accordance with the software license agreement as defined in FAR 52.227-7013. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. The code names presented in this document are only for use by Intel to identify products, technologies, or services in development that have not been made commercially available to the public, i.e., announced, launched, or shipped. They are not commercial names for products or services and are not intended to function as trademarks. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel’s website at  http://www.intel.com/design/literature.htm . Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See  http://www.intel.com/products/processor_number   for details. Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the United States and other countries .  * Other brands and names may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved. Intel® Edison Module Hardware Guide September 2014 2 Document Number: 331189-002    Contents 1   Introduction ....................................................................................................................................................................... 6   1.1   References ........................................................................................................................................................................................ 6   2   High-Level Functional Description ............................................................................................................................... 7   2.1   Block diagram ................................................................................................................................................................................. 8   2.2   Module photos ............................................................................................................................................................................... 8   3   Component and Subsystem Details............................................................................................................................ 10   3.1   Intel® Atom™ processor Z34XX ............................................................................................................................................ 10   3.2   Wi-Fi / BT module ...................................................................................................................................................................... 10   3.3   Managed NAND (eMMC) flash .............................................................................................................................................. 10   3.4   DDR SDRAM .................................................................................................................................................................................. 10   3.5   Power management IC (PMIC).............................................................................................................................................. 11   3.6   USB 2.0 transceiver ULPI interface .................................................................................................................................... 11   3.7   Integrated chip antenna or u.FL connector for external antenna ....................................................................... 11   3.8   70-pin interface connector .................................................................................................................................................... 12   4   External Interfaces on 70-Pin Connector .................................................................................................................. 15   4.1   I 2 C Interfaces ................................................................................................................................................................................ 15   4.2   SD card interface ........................................................................................................................................................................ 15   4.3   UART interfaces .......................................................................................................................................................................... 15   4.4   SPI interface.................................................................................................................................................................................. 16   4.5   I2S interface .................................................................................................................................................................................. 16   4.6   PWM ................................................................................................................................................................................................. 17   4.7   GPIO ................................................................................................................................................................................................. 17   4.8   USB ................................................................................................................................................................................................... 18   4.9   Clocks .............................................................................................................................................................................................. 18   4.10   System reset ................................................................................................................................................................................. 18   4.11   Special software recovery ...................................................................................................................................................... 19   4.12   Power input and output .......................................................................................................................................................... 19   4.13   V_VBAT_BKUP ............................................................................................................................................................................. 19   5   Powering Edison ............................................................................................................................................................. 20   5.1   Main power supply VSYS ....................................................................................................................................................... 20   5.2   Lithium-polymer battery direct attach ............................................................................................................................. 20   5.3   Lithium-polymer battery with diode or FET isolation ............................................................................................... 21   5.4   Connection to USB VBUS ....................................................................................................................................................... 21   5.5   Cold boot sequence .................................................................................................................................................................. 22   6   Edison Mechanicals ........................................................................................................................................................ 23   7   Layout ................................................................................................................................................................................ 24   7.1   Antenna keepout ........................................................................................................................................................................ 24   7.2   Layout SD card, I2S, SPI, I2C ................................................................................................................................................. 24   7.3   Layout DXF .................................................................................................................................................................................... 25   7.4   Layout PTC EMN files ............................................................................................................................................................... 25   8   Handling ........................................................................................................................................................................... 27   9   Debug UART Errata ......................................................................................................................................................... 28   Intel® Edison Module September 2014 Hardware Guide Document Number: 331189-002 3    Figures Figure 1   Edison block diagram ............................................................................................................................................................. 8   Figure 2   Edison top view ......................................................................................................................................................................... 8   Figure 3   Edison bottom view ................................................................................................................................................................. 9   Figure 4   Example Edison external USB design .......................................................................................................................... 18   Figure 5   Example Edison lithium-polymer battery direct attach ...................................................................................... 20   Figure 6   Example Edison lithium-polymer battery with FET isolation ........................................................................... 21   Figure 7   Edison cold boot sequence .............................................................................................................................................. 22   Figure 8   Edison mechanical dimensions (top view through PCB) ..................................................................................... 23   Figure 9   Area around antenna ........................................................................................................................................................... 24   Figure 10   Layout DXF ............................................................................................................................................................................... 25   Figure 11   PTC EMN graphic ................................................................................................................................................................... 25   Figure 12   EDISON H383485-300 ....................................................................................................................................................... 26   Figure 13   Inserting an Edison module .............................................................................................................................................. 27   Tables Table 1   Product-specific documents ............................................................................................................................................... 6   Table 2   Hardware features .................................................................................................................................................................... 7   Table 3   Edison 70-pin connector part numbers ..................................................................................................................... 12   Table 4   Edison 70-pin connector board-to-board mating height .................................................................................. 12   Table 5   Edison connector pinout and signal list ..................................................................................................................... 13   Table 6   Edison I2S available formats ............................................................................................................................................ 16   Table 7   Edison PWM programming examples ......................................................................................................................... 17   Table 8   Layout SD card........................................................................................................................................................................ 24   Intel® Edison Module Hardware Guide September 2014 4 Document Number: 331189-002