Transcript
IC Testing and Development in Semiconductor Area Prepare by Lee Zhang, 2004
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Outline 1. Electronic Industry Development 2. Semiconductor Industry Development
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Outline 1. Electronic Industry Development 2. Semiconductor Industry Development
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4Electronic
Industry Development
Electronic Industry in Worldwide and in China Wide Electronic product revenue in worldwide is $1.5 trillion (US dollar) at year of 2003. Electronic product revenue in China wide is $160 billion (US dollar) at year of 2003, which is about 11% of world revenue. Electronic product revenue in China wide is $180 billion (US dollar) at year of 2004, and it will be reached $270 billion by 2007.
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4Electronic
Industry Development
Electronic Industry in Worldwide and in China Wide Electronic industry revenue in China wide is $227 billion (US dollar) at year of 2003. 2003 China electronics export is $124 billion, 1/3 of China total export.
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4Electronic
Industry Development
Electronic Products Produced on 2003 PC revenue was 48 million units. TV revenue was 58 million units. Mobile phone was 211 million units. Communication bandwidth exchange equipments were increased by over 40%. Auto mobile industries were increased by over 40% and will be reached $5.5 billion revenue on 2007.
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4Electronic
Industry Development
Electronic Products vs. Semiconductor Semiconductor revenue in worldwide is $163 billion (US dollar) at year of 2003. Semiconductor revenue in China wide is $25.2 billion at year of 2003, which is about 16% of worldwide revenue. 1) CPU design and development 2) DSP design and development 3) LCD design and development 4) Mobile phone related chip design and development
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4Semiconductor
Development
How to look into semiconductor industry development? People give a prediction for 10 years or 50 years or forever in changing or keeping semiconductor materials or factor. Companies change the strategy to challenge the semiconductor industry. More business specialists believe the market is the key to look into. Someone only look for the business cycles to believe the development no ending.
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4Semiconductor
Development
How to look into China ’ s semiconductor industry development?
China’ s semiconductor industry has a very young age. China’ s semiconductor is learning the business strategies from USA, Japan, and Europe. China is not concerning the problem with the world but we need more intellectual properties. China would look into high-end products in semiconductor development.
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4Semiconductor
Development
The Strong Point and The Weak Point From China Semiconductor Development Developing traditional and continuous able products (like analog circuit design). Developing new mini product design and simple circuit design (like digital circuit design on mobile phone chip, smart card chip). Semiconductor manufacturing cost reduction and competition (low-end process like 6” wafer manufacture).
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4Semiconductor
Development
The Strong Point and The Weak Point From China Semiconductor Development Build low cost bases for manufacturing of assembly and testing (like real-state cost, facility cost, material cost and engineer cost). Lack of intellectual property of design and technology. Lack of good base of technology research and professional experience on high-end design. Lack of long-term strategies to invest a research and development center.
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Outline 1. Overview IC Testing Establishment 2. The Types of Tests in IC Manufacture 3. The Types of IC Product Tests 4. Test Classification 5. Basic Manufacture Test Flow 6. Basic Production Test Flow 7. Impact Test Cost in IC Manufacture 业实集成 版权所有 翻印必究 www.yesic.com.cn
Outline 8. Impact Test Cycle in IC Manufacture 9. Objectives of Product and Production Testing 10. Test vs. Quality and Reliability 11. Tester Divided by Test Capabilities 12. Tester Divided by Test Functions 13. Other Important Facilities
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4Overview
IC Test Establishment
How is IC test established? From design point of view From manufacture point of view From system design point of view From failure analysis point of view From customer requirement point of view How important is the testing in IC industry? Measuring new products realistic Monitoring manufacture process Evidence for consumer acceptance 业实集成 版权所有 翻印必究 www.yesic.com.cn
4Overview
IC Test Establishment
What is the future development for IC test? Design for self-test Separate IP core test Multiple test methods on single tester Simple product test with complicated tester Reduce software development time
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4Types
of Testing in IC Mfg.
How many are the major types of testing? Design type of test. Manufacture or product type of test. Production type of test. Reliability type of test. Physical failure analysis type of test. Detail Included Each Test Type Design types: design simulation test, design debug test, design characterization test and design qualification test. 业实集成 版权所有 翻印必究 www.yesic.com.cn
4Types
of Testing in IC Mfg.
Detail Included Each Test Type Mfg and product types: process step test, E (electron) test, engineering test and yield enhancement test. Production types: wafer probing test, assembly package test, final test and QA test. Reliability types: characterization test and qualification test. Physical FA types:
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4Types
of Product Testing
Six Types of Product Testing in IC Field Memory types – ROM and RAM devices. Logic types – programmable logic devices. System types – embedded, microcontroller, Soc devices.
Mixed-signal types – analog and digital devices.
RF types – optical and communication devices.
LCD types – display driver devices.
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4Testing
Classification
Memory Testing (SRAM, DRAM, EEPROM, Flash Memory, Embedded Memory) Logic Testing (ASIC, FPGA, PLD, CPU) Mixed Signal Testing (ADC, DAC) SoC Testing (System on Chip Device) LCD Testing (Liquid Crystal Driver) IP Testing (PLL, ADC, DAC, USB, Bandgap, Vregulator, High-Speed I/O and so on)
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4Impact
of Testing Cost
Requiring huge amounts of investments Largely varying with volumes Product and process maturity Product and process complexity Product lead time (testing on wafer, packaging cycle time and package testing)
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4Impact
of Testing Cycle
Design for Testability (DFT in design side) Characterization (design development) Reliability Assessment (process manufacturing) Pre-production Testing (product engineering) Production Testing (production manufacturing) Yield Enhancement (product engineering)
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4Impact
of Testing Cycle
Performance Improvement (process engineering) Test cost Reduction (manufacturing side) Product Cost Reduction (production side)
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4Objective
of Production Testing
Screening sequence Performance of specification Collecting data for better control Manufacturing process fine-tuning Progress in yield enhancement process Same product by different classes of performance (speed, vcc range, temperature range, W/R & R/W performance)
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4Testing
vs. Quality and Reliability
Design of the cell, process and product Debug and characterization of process and product Manufacturing machine: equipment, resources, materials and so on The overall process control The reliability assessment of process and product The overall know-how of the manufacture
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4Tester
Divided by Test Capabilities Bench-top Tester (PC based, Power Meter, Power Supply, Oscilloscopes and so on)
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4Tester
Divided by Test Capabilities
Automatic Tester (Advantest, HP93000 Tester, Mosaid Tester and Teradyne Tester and so on)
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4Tester
Divided by Test Functions
Logic Device (Credence Tester, HP93000 Tester, Teradyne Tester and so on ) Memory Device (Advantest, Mosaid Tester) Mixed-Signal Device (Teradyne Tester and HP93000, Yokogawa Tester and so on) SoC/LCD Device (Teradyne Tester and Yokogawa Tester and so on) IP Testchip (Bench-Top and ATE)
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4Other
Important Facilities
Probe Station Handler Laser Repair/Laser Mark Probe Card DUT Board
4x1
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Outline 1. Purpose of Testing 2. Basic Test Flow and DUT Flow 3. Basic Test Items 4. Test Methodology and Test Flow
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1) Purposes of Testing For Design Houses or for Foundry - Guarantee the products meet design targets. - Pre-screen for reliability test. - Quality assurance to the production process. - Meet customer spec. and requirement. For Customers - Verification of the product’ s functions - Monitor the quality of incoming products
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2) Basic Testing Flow
IC Fabrication
Shipped Parts
Testing Yield:
Quality:
Fraction of good parts
Defective parts per million (DPM)
Rejects
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2) Basic DUT Flow
Test Stimulus
DUT
DUT Response Good Or Bad ?
Fail
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Pass
3) Basic Test Items 4DC
Parameter Test (Static Test)
4Functional 4 AC
Test
Parameter Test (Dynamic Test)
4Reliability
Related Test
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4DC
Parameter Test
When a voltage or current is measured during the test and the pass/fail results are based upon the measured value
Continuity Test (Open & Short) Leakage Test. (Iil / lih) Output Driving Test (Vol / Voh, Iol / IoH) Dynamic Current Test (Power Consumption) Quiescent Current Test (Standby and Power Down)
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4DC
Parameter Test (Datasheet)
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4Function
Test
When the device is actively performing logical functions. Input data is supplied to DUT and output data is read from the DUT to determine the pass/fail results of the test.
Configuration Test (registers, state-machine and output configuring and logic functionality) Pattern Test (program/verify or write/read and different patterns test and memory functionality) Sense Amplifier Functionality Test Build-in-Self-Test (BIST and DFT)
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4AC
Parameter Test
AC testing is performed by setting up the appropriate timing values (edge placements) and signal formats as defined in the device AC specification and then executing a functional test sequence.
Setup Time Hold Time Output Propagation Delay Pulse Width Rising Time Falling Time
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4AC
Parameter Test (Datasheet
4AC
Parameter Test (Timing Diagram)
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- Setup Time
Data Input Setup Time Relative to /WE Low to High Transition WE
Data In Setup Time
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- Hold Time Data Input Hold Time Relative to /WE Low to High Transition WE
Data In Hold Time
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- Propagation Delay Output Propagation Delay Relative to Address Valid Time
Address
Vali d Addr ess
Valid Dat a
Data In
Propagation Delay 业实集成 版权所有 翻印必究 www.yesic.com.cn
- Pulse Width/Rise Time/Fall Time
WE
Pulse Width
Data In
Rise Time
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Fall Time
- AC Signal Waveform
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4Reliability
Related Test
Program Cycling Test Program High Temperature Test Bake Between Test from Step to Step Burn-in Between Test from Step to Step
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4) Test Methodology & Test Flow 4Test
Aspects
4Test
Methods
4Block 4Test
Test Flow
Program Flow
4Software
Accomplishment
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4Test
Aspects
DC Test & Parametric AC Test & Parametric Functional Programming Test Retention / Endurance Reliability Test Write / Read / Verify Functional Test Mixed Signal Converting Test High Speed I/O Driver Test Check Build-In-Self-Test Frequency / Timing Input and Output Test
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4Test
Methods
Understand Device Technology (Memory, SoC or Mixed-Signal, or Logic CPU) Understand Test Specification and Criteria (Datasheet, Design Architecture) Create a Block Test Flow (Test steps of overall) Create a Detail Spec. Test Flow (Program test flow) Program Development -> Program Debugging > Program Verification Program Delivery to Engineering Test or Production Test 业实集成 版权所有 翻印必究 www.yesic.com.cn
4Manufactury
Final (Package) Testing
Wafer Acceptance Testing
Design Debug Testing
Wafer Sort Testing
Test Flow
Quality Control Testing
Reliability Testing
Incoming (Inspection) Testing
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Characterization (Engineering) Testing
4Production
Test Flow
Wafer Acceptance Testing Wafer Sort Testing Repair If Failed Testing
Final (Package) Testing Packaging If Passed Testing
Marking And Testing Quality Control Testing
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FG or Shipping
4Block
Test Flow
Wafer Sort 1
Bake at High Temp.
Wafer Sort 2
Assembly (Package)
Final Test 1
Burn-in For Monitor
Final Test 2
QA/QC Test
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4Test Continuity Test
ICC and Standby Test
Configuration Or Logic Test
Program Flow Program Ptn And Verify
AC Parameter Test
AD/DA Convert Test
Program Pattern & ID
Bist and Scan Test
Verify Pattern & ID
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4Software
Accomplishment
Wafersort 1(Chip Probing -1) Test Program Wafersort 2 (Chip Probing -2) Test Program Final Test Program 1 Final Test Program 2 QA/QC Test Program (Qualification check for delivery test)
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